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Process Capabilities-PCB

Items Technology & Capability
Max. Layer Count 26 Layer
Max. Panel Size 21” x 24”
Max. Board Thickness 236mil (6.0mm)
Min. Board Thickness 2L–10mil (0.25mm)
4L–14mil (0.35mm)
6L– 20mil (0.50mm)
Max. Final Copper Thickness(Inner Layer) 4 oz
Max. Final Copper Thickness(Outer Layer) 6 oz (Finished)
Min. Line Width/Space 3mil / 3mil (0.0762mm)
Aspect Ratio 12:1
Impedance Tolerance Control ±10%
Material 1. FR4-Tg140 ~ Tg180
2. HALOGEN-FREE
3. CTI600
Carbon ink Yes
Peelable Mask Yes
Contouring 1. Routing
2. V-Groove
3. Beveling
4. Punch
Surface Finish 1. HASL (LF)
2. OSP(ENTEK)
3. Immersion Gold
4. Immersion Silver & Tin
5. ENEPIG
6. Electroless Nickel Immersion Gold(ENIG)

We are dedicated to delivering stable, reliable process quality and versatile manufacturing services, making us your ideal partner for PCB design and mass production.
For more information on application cases or customized solutions, please contact our sales team at any time.
I hope to hear from you soon.

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