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Process Capabilities-PCB
| Items | Technology & Capability |
|---|---|
| Max. Layer Count | 26 Layer |
| Max. Panel Size | 21” x 24” |
| Max. Board Thickness | 236mil (6.0mm) |
| Min. Board Thickness |
2L–10mil (0.25mm) 4L–14mil (0.35mm) 6L– 20mil (0.50mm) |
| Max. Final Copper Thickness(Inner Layer) | 4 oz |
| Max. Final Copper Thickness(Outer Layer) | 6 oz (Finished) |
| Min. Line Width/Space | 3mil / 3mil (0.0762mm) |
| Aspect Ratio | 12：1 |
| Impedance Tolerance Control | ±10% |
| Material |
1. FR4-Tg140 ~ Tg180 2. HALOGEN-FREE 3. CTI600 |
| Carbon ink | Yes |
| Peelable Mask | Yes |
| Contouring |
1. Routing 2. V-Groove 3. Beveling 4. Punch |
| Surface Finish |
1. HASL (LF) 2. OSP(ENTEK) 3. Immersion Gold 4. Immersion Silver & Tin 5. ENEPIG 6. Electroless Nickel Immersion Gold(ENIG) |
We are dedicated to delivering stable, reliable process quality and versatile manufacturing services, making us your ideal partner for PCB design and mass production.
For more information on application cases or customized solutions, please contact our sales team at any time.
I hope to hear from you soon.